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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：25/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
Strain-tolerant die attach with improved thermal conductivity, and method of fabrication 专利
专利类型: 授权发明, 专利号: US10410958, 申请日期: 2019-09-10, 公开日期: 2019-09-10
发明人:  KARLICEK, JR., ROBERT F.
Adobe PDF(1922Kb)  |  收藏  |  浏览/下载：121/0  |  提交时间：2019/12/24
Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
Adobe PDF(2834Kb)  |  收藏  |  浏览/下载：238/1  |  提交时间：2018/12/03
Electricity  Electronic Packaging  Joining Process  Nanoporous Materials  Thermal Resistance  
Medium and High Voltage IGBT Module Using Nanosilver Paste Sintering Technology and Its Performance Characterization 期刊论文
Gaodianya Jishu/High Voltage Engineering, 2017, 卷号: 43, 期号: 10, 页码: 3307-3312
作者:  Mei, Yunhui;  Feng, Jingjing;  Wang, Xiaomin;  Lu, Guoquan;  Zhang, Peng;  Lin, Zhongkang
Adobe PDF(2050Kb)  |  收藏  |  浏览/下载：152/0  |  提交时间：2018/12/12
采用纳米银焊膏烧结互连技术的中高压IGBT模块及其性能表征 期刊论文
高电压技术, 2017, 期号: 10, 页码: 3307-3312
作者:  梅云辉;  冯晶晶;  王晓敏;  陆国权;  张朋;  林仲康
Adobe PDF(2054Kb)  |  收藏  |  浏览/下载：205/1  |  提交时间：2017/12/31
Method of producing a semiconductor device by bonding silver oxide on a surface of a semiconductor element with silver or silver oxide on a surface of a base 专利
专利类型: 发明申请, 专利号: EP3151268A2, 申请日期: 2017-04-05, 公开日期: 2017-04-05
发明人:  KURAMOTO, MASAFUMI;  OGAWA, SATORU;  NIWA, MIKI
Adobe PDF(349Kb)  |  收藏  |  浏览/下载：47/0  |  提交时间：2019/12/30
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：340/2  |  提交时间：2017/07/06
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：218/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions 期刊论文
MICROELECTRONICS RELIABILITY, 2015, 卷号: 55, 期号: 12, 页码: 2532-2541
作者:  Yan, Haidong;  Mei, Yunhui;  Li, Xin;  Zhang, Pu;  Lu, Guo-Quan;  Mei, YH
Adobe PDF(2559Kb)  |  收藏  |  浏览/下载：247/1  |  提交时间：2015/12/02
Nanosilver Paste  Laser Module  Die-attach Interface  Pulse Mode  Reliability  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：229/1  |  提交时间：2015/12/04