Xi'an Institute of Optics and Precision Mechanics,CAS
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology | |
Yu, Dongshan1; Liang, Xuejie1; Wang, Jingwei1; Li, Xiaoning1; Nie, Zhiqiang2; Liu, Xingsheng1,2 | |
2017 | |
会议名称 | Novel In-Plane Semiconductor Lasers XVI 2017 |
会议录名称 | Novel In-Plane Semiconductor Lasers XVI |
卷号 | 10123 |
会议日期 | 2017-01-30 |
会议地点 | San Francisco, CA, United states |
出版者 | SPIE |
产权排序 | 1 |
摘要 | A novel marco channel cooler (MaCC) has been developed for packaging high power diode vertical stacked (HPDL) lasers, which eliminates many of the issues in commercially-available copper micro-channel coolers (MCC). The MaCC coolers, which do not require deionized water as coolant, were carefully designed for compact size and superior thermal dissipation capability. Indium-free packaging technology was adopted throughout product design and fabrication process to minimize the risk of solder electromigration and thermal fatigue at high current density and long pulse width under QCW operation. Single MaCC unit with peak output power of up to 700W/bar at pulse width in microsecond range and 200W/bar at pulse width in millisecond range has been recorded. Characteristic comparison on thermal resistivity, spectrum, near filed and lifetime have been conducted between a MaCC product and its counterpart MCC product. QCW lifetime test (30ms 10Hz, 30% duty cycle) has also been conducted with distilled water as coolant. A vertical 40-MaCC stack product has been fabricated, total output power of 9 kilowatts has been recorded under QCW mode (3ms, 30Hz, 9% duty cycle). © 2017 SPIE. |
作者部门 | 炬光科技有限公司 |
DOI | 10.1117/12.2250692 |
收录类别 | EI ; ISTP |
ISBN号 | 9781510606876 |
语种 | 英语 |
ISSN号 | 0277786X |
引用统计 | |
文献类型 | 会议论文 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/29028 |
专题 | 炬光科技有限公司 瞬态光学研究室 |
作者单位 | 1.Focuslight Technologies Inc, No. 56 Zhangba liu Road, High-Tech Zone, Xi'an, Shaanxi; 710077, China 2.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an Hi-Tech Industrial Development Zone, No. 17 Xinxi Road, New Industrial Park, Xi'an, Shaanxi; 710119, China |
推荐引用方式 GB/T 7714 | Yu, Dongshan,Liang, Xuejie,Wang, Jingwei,et al. High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology[C]:SPIE,2017. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
High power vertical (667KB) | 会议论文 | 限制开放 | CC BY-NC-SA | 请求全文 |
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