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Thermal design for the package of high-power single-emitter laser diodes 期刊论文
Optics and Laser Technology, 2020, 卷号: 129
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(6158Kb)  |  收藏  |  浏览/下载：216/2  |  提交时间：2020/05/14
High-power laser diodes  Thermal design  Thermal resistance  Heat sink  Submount  Heat spreading angle  
Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress 期刊论文
OPTICAL ENGINEERING, 2020, 卷号: 59, 期号: 3
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1418Kb)  |  收藏  |  浏览/下载：178/2  |  提交时间：2020/04/27
thermal  induced stress  diode laser arrays  near-field bowing  SMILE  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：173/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 24, 页码: 6672-6677
作者:  Zhang, Hongyou;  Fu, Tuanwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(794Kb)  |  收藏  |  浏览/下载：192/3  |  提交时间：2019/09/02
Three-dimensional thermal model of high-power semiconductor lasers 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 14, 页码: 3892-3901
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1854Kb)  |  收藏  |  浏览/下载：195/3  |  提交时间：2019/06/27
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：291/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：120/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：141/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
Three-dimensions thermal model of a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 期号: 33, 页码: 9868-9876
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(2076Kb)  |  收藏  |  浏览/下载：202/2  |  提交时间：2018/12/10
Effect of submount thickness on near-field bowing of laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 28, 页码: 8407-8411
作者:  Zhang, Hongyou;  Chen, Tianqi;  Zhang, Pu;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1049Kb)  |  收藏  |  浏览/下载：176/3  |  提交时间：2018/11/02