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Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 24, 页码: 6672-6677
Authors:  Zhang, Hongyou;  Fu, Tuanwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(794Kb)  |  Favorite  |  View/Download:34/3  |  Submit date:2019/09/02
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
Authors:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  Favorite  |  View/Download:28/1  |  Submit date:2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular