Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting | |
Zhang, Hongyou1,2,3; Fu, Tuanwei3; Zah, Chung-En3; Liu, Xingsheng1,2,3,4 | |
作者部门 | 瞬态光学研究室 |
2019-08-20 | |
发表期刊 | Applied Optics |
ISSN | 1559128X;21553165 |
卷号 | 58期号:24页码:6672-6677 |
产权排序 | 1 |
摘要 | In this paper, the packaging-induced stresses are theoretically calculated by modeling multilayered structures for different packaging structures. We report a method to measure the packaging-induced stress of a laser diode array (LDA) by comparing the emission wavelength of the single emitter located in the middle of a laser bar before and after packaging. The wavelength is tested under a low duty cycle (50 μs/10 Hz, DC 0.05%) to eliminate the thermal effect to wavelength shifting. Experimental calculation results for the packaging-induced stress of LDAs are in good agreement with the theoretical calculations and simulation results. For a GaAs laser bar, we find the packaging stresses are compression stresses, which make the emission wavelength blue-shift in terms of 1.09 × 10−2 nmMPa. We propose a mapping of packaging-induced stress distribution in laser bars on a microscopic scale by considering the emission spectra of each emitter in a laser bar. Compared to single-emitter resolved photo-current or micro-photoluminescence measurements, as proposed by other authors, we offer a much easier tool to test and map the distribution of packaging-induced stress in laser bars. © 2019 Optical Society of America. |
DOI | 10.1364/AO.58.006672 |
收录类别 | SCI ; EI |
语种 | 英语 |
WOS记录号 | WOS:000482095100026 |
出版者 | OSA - The Optical Society |
EI入藏号 | 20193407351742 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/31762 |
专题 | 瞬态光学研究室 |
通讯作者 | Zhang, Hongyou |
作者单位 | 1.State Key Laboratory of Transient Optics and Photonics, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an, Shanxi; 710077, China; 2.University of Chinese Academy of Sciences, Beijing; 100049, China; 3.Focuslight Technologies Inc., Xi’an, Shanxi; 710077, China; 4.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing; 100049, China |
推荐引用方式 GB/T 7714 | Zhang, Hongyou,Fu, Tuanwei,Zah, Chung-En,et al. Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting[J]. Applied Optics,2019,58(24):6672-6677. |
APA | Zhang, Hongyou,Fu, Tuanwei,Zah, Chung-En,&Liu, Xingsheng.(2019).Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting.Applied Optics,58(24),6672-6677. |
MLA | Zhang, Hongyou,et al."Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting".Applied Optics 58.24(2019):6672-6677. |
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文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
Easy method to measu(794KB) | 期刊论文 | 出版稿 | 限制开放 | CC BY-NC-SA | 请求全文 |
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