Thermal design for the package of high-power single-emitter laser diodes

doi:10.1016/j.optlastec.2020.106266

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	Thermal design for the package of high-power single-emitter laser diodes
	Wu, Di-Hai 1,2,3; Zah, Chung-En 3; Liu, Xingsheng3
作者部门	瞬态光学研究室
	2020-09
发表期刊	Optics and Laser Technology
ISSN	00303992
卷号	129
产权排序	1
摘要	An analytical three-dimensional thermal model is employed to perform the thermal design for the package of high-power single-emitter laser diodes. Thermal design curves for the heat sink and submount are presented in detail, for laser diodes subjected to several convective heat transfer conditions on the bottom of the heat sink. An effective heat spreading angle is proposed to characterize thermal design for the heat sink. A differential heat spreading angle is proposed to clearly manifest heat flow in the packages. Full width and length at 90% energy are introduced to reveal the requirement of submount width and length, respectively. The impact of coefficient of thermal expansion (CTE)-matched sandwiched submount on total heat dissipation is studied. Special discussion is presented for a commercial F-Mount laser diode, and it is found that current heat sink design leads to a 27.4% increase in thermal resistance relative to a free lateral diffusion package. © 2020 Elsevier Ltd
关键词	High-power laser diodes Thermal design Thermal resistance Heat sink Submount Heat spreading angle
DOI	10.1016/j.optlastec.2020.106266
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000537415900008
出版者	Elsevier Ltd
EI入藏号	20201608460737
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.opt.ac.cn/handle/181661/93401
专题	瞬态光学研究室
作者单位	1.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, No. 17 Xinxi Road, Xi'an High-Tech Zone, Xi'an; Shaanxi; 710119, China; 2.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, No. 19 Yuquan Road, Shijingshan District, Beijing; 100049, China; 3.Focuslight Technologies Inc., No. 56 Zhangba 6th Road, Xi'an High-Tech Zone, Xi'an; Shaanxi; 710077, China
推荐引用方式 GB/T 7714	Wu, Di-Hai,Zah, Chung-En,Liu, Xingsheng. Thermal design for the package of high-power single-emitter laser diodes[J]. Optics and Laser Technology,2020,129.
APA	Wu, Di-Hai,Zah, Chung-En,&Liu, Xingsheng.(2020).Thermal design for the package of high-power single-emitter laser diodes.Optics and Laser Technology,129.
MLA	Wu, Di-Hai,et al."Thermal design for the package of high-power single-emitter laser diodes".Optics and Laser Technology 129(2020).

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