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高功率半导体激光器热设计及其对光谱特性影响的研究 学位论文
, 北京: 中国科学院大学, 2019
Authors:  吴的海
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高功率半导体激光器  热阻  温度均匀性  光谱展宽  传导冷却  微通道热沉  
Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 24, 页码: 6672-6677
Authors:  Zhang, Hongyou;  Fu, Tuanwei;  Zah, Chung-En;  Liu, Xingsheng
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Three-dimensional thermal model of high-power semiconductor lasers 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 14, 页码: 3892-3901
Authors:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
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Thermal hydraulic performance of a microchannel heat sink for cooling a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 8, 页码: 1966–1977
Authors:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
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The infrared moving target extraction and fast video reconstruction algorithm 期刊论文
INFRARED PHYSICS & TECHNOLOGY, 2019, 卷号: 97, 页码: 85-92
Authors:  Qiu, Shi;  Tang, Ying;  Du, Yun;  Yang, Song
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Infrared image  Moving target extraction  Background reconstruction  VIBE  
Femtosecond Laser Irradiation of Carbon Nanotubes to Metal Electrodes 期刊论文
APPLIED SCIENCES-BASEL, 2019, 卷号: 9, 期号: 3
Authors:  Cui, Jianlei;  Cheng, Yang;  Zhang, Jianwei;  Mei, Huanhuan;  Wang, Xuewen
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carbon nanotubes  connection  laser-induced processing  contact resistance  
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
Authors:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  Favorite  |  View/Download:28/1  |  Submit date:2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
Authors:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
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Thermal stress  laser diode array  SMILE effect  spectrum  
Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
Authors:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
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Electricity  Electronic Packaging  Joining Process  Nanoporous Materials  Thermal Resistance  
Three-dimensions thermal model of a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 期号: 33, 页码: 9868-9876
Authors:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
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