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Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：280/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
Thermally induced chirp studies on spectral broadening of semiconductor laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 20, 页码: 5599-5603
作者:  Zhang, Hongyou;  Jia, Yangtao;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1168Kb)  |  收藏  |  浏览/下载：209/2  |  提交时间：2018/09/12
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：240/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Method to improve near-field nonlinearity of a high-power diode laser array on a microchannel cooler 期刊论文
OPTICAL ENGINEERING, 2018, 卷号: 57, 期号: 3
作者:  Zhang, Hongyou;  Jia, Yangtao;  Cai, Wanshao;  Tao, Chunhua;  Zah, Chung-en;  Liu, Xingsheng;  Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(1473Kb)  |  收藏  |  浏览/下载：280/2  |  提交时间：2018/04/19
Thermal Stress  Diode Laser Arrays  Near-field Nonlinearity  Near-field Nonlinearity Along Laser Bar  
Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Fan, Yingmin;  Wang, Jingwei;  Cai, Lei;  Mitra, Thomas;  Hauschild, Dirk;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(5638Kb)  |  收藏  |  浏览/下载：460/2  |  提交时间：2018/04/25
High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2018/04/25
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：253/2  |  提交时间：2018/04/25
Study on the near-field non-linearity (SMILE) of high power diode laser arrays 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Zhang, Hongyou;  Jia, Yangtao;  Li, Changxuan;  Zah, Chung-En;  Liu, Xingsheng;  Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(770Kb)  |  收藏  |  浏览/下载：251/2  |  提交时间：2018/04/25
Thermal characteristics of kW-level conduction-cooled semiconductor laser array 期刊论文
Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering, 2017, 卷号: 46, 期号: 10
作者:  Zhu, Qiwen;  Zhang, Pu;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(631Kb)  |  收藏  |  浏览/下载：285/2  |  提交时间：2017/12/30
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：333/2  |  提交时间：2017/07/06