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Thermally induced chirp studies on spectral broadening of semiconductor laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 20, 页码: 5599-5603
作者:  Zhang, Hongyou;  Jia, Yangtao;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1168Kb)  |  收藏  |  浏览/下载：209/2  |  提交时间：2018/09/12
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Method to improve near-field nonlinearity of a high-power diode laser array on a microchannel cooler 期刊论文
OPTICAL ENGINEERING, 2018, 卷号: 57, 期号: 3
作者:  Zhang, Hongyou;  Jia, Yangtao;  Cai, Wanshao;  Tao, Chunhua;  Zah, Chung-en;  Liu, Xingsheng;  Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(1473Kb)  |  收藏  |  浏览/下载：281/2  |  提交时间：2018/04/19
Thermal Stress  Diode Laser Arrays  Near-field Nonlinearity  Near-field Nonlinearity Along Laser Bar  
Thermal characteristics of kW-level conduction-cooled semiconductor laser array 期刊论文
Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering, 2017, 卷号: 46, 期号: 10
作者:  Zhu, Qiwen;  Zhang, Pu;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(631Kb)  |  收藏  |  浏览/下载：285/2  |  提交时间：2017/12/30
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2012, 卷号: 134, 期号: 4, 页码: 041003
作者:  Yan, Yi;  Chen, Xu;  Liu, Xingsheng;  Mei, Yunhui;  Lu, Guo-Quan
Adobe PDF(1975Kb)  |  收藏  |  浏览/下载：225/0  |  提交时间：2013/10/11
Nanosilver Paste  Laser Diodes  Die Bonding  
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging