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Thermal design for the package of high-power single-emitter laser diodes 期刊论文
Optics and Laser Technology, 2020, 卷号: 129
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(6158Kb)  |  收藏  |  浏览/下载：216/2  |  提交时间：2020/05/14
High-power laser diodes  Thermal design  Thermal resistance  Heat sink  Submount  Heat spreading angle  
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1435Kb)  |  收藏  |  浏览/下载：162/1  |  提交时间：2020/05/18
High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：172/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
A High-Performance Annularly Stacked Laser Diode Pump 会议论文
SEMICONDUCTOR LASERS AND APPLICATIONS X, ELECTR NETWORK, 2020-10-12
作者:  Li, Junli;  Sun, Lichen;  Liu, Ming;  Han, Yang;  Fu, Tuanwei;  Cai, Lei;  Zheng, Yanfang;  Yan, Minna;  Wang, Juan;  Tao, Chunhua;  Gao, Lijun;  Wang, Jingwei;  Zah, Chung-en;  Liu, Xingsheng
Adobe PDF(941Kb)  |  收藏  |  浏览/下载：168/2  |  提交时间：2021/04/15
high peak power  annular stack  macro channel  uniformity of centroid wavelength  
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：289/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：129/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：241/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：280/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：171/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power