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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：29/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：246/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays 期刊论文
Guangzi Xuebao/Acta Photonica Sinica, 2017, 卷号: 46, 期号: 9
作者:  Lu, Yao;  Nie, Zhi-Qiang;  Chen, Tian-Qi;  Zhang, Pu;  Xiong, Ling-Ling;  Wu, Di-Hai;  Li, Xiao-Ning;  Wang, Zhen-Fu;  Liu, Xing-Sheng;  Nie, Zhi-Qiang (niezq@opt.ac.cn)
Unknown(4848Kb)  |  收藏  |  浏览/下载：197/2  |  提交时间：2017/12/30
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：221/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions 期刊论文
MICROELECTRONICS RELIABILITY, 2015, 卷号: 55, 期号: 12, 页码: 2532-2541
作者:  Yan, Haidong;  Mei, Yunhui;  Li, Xin;  Zhang, Pu;  Lu, Guo-Quan;  Mei, YH
Adobe PDF(2559Kb)  |  收藏  |  浏览/下载：251/1  |  提交时间：2015/12/02
Nanosilver Paste  Laser Module  Die-attach Interface  Pulse Mode  Reliability  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：236/1  |  提交时间：2015/12/04
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Zhang, Pu;  Wang, Jingwei;  Xiong, Lingling;  Li, Xiaoning;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(624Kb)  |  收藏  |  浏览/下载：200/1  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：214/0  |  提交时间：2015/12/04
Study of the key aspects in developing kW-level diode lasers for solid state laser pumping 会议论文
Proceedings - 2014 International Conference Laser Optics, LO 2014, St. Petersburg, Russia, 2014-06-30
作者:  Li, Xiaoning;  Wang, Jingwei;  Cai, Wanshao;  Hao, Bei;  Hou, Dong;  Liu, Hui;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(249Kb)  |  收藏  |  浏览/下载：254/2  |  提交时间：2015/03/31
大功率半导体激光器阵列热串扰行为 期刊论文
强激光与粒子束, 2013, 期号: 8, 页码: 1904-1910
作者:  张志勇;  张普;  聂志强;  李小宁;  熊玲玲;  刘晖;  王贞福;  刘兴胜
Adobe PDF(957Kb)  |  收藏  |  浏览/下载：351/2  |  提交时间：2014/09/17