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Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays
其他题名传导冷却单巴高功率半导体激光器热应力和smile研究
Lu, Yao1,2; Nie, Zhi-Qiang1; Chen, Tian-Qi1,2; Zhang, Pu1; Xiong, Ling-Ling1; Wu, Di-Hai1,2; Li, Xiao-Ning3; Wang, Zhen-Fu1; Liu, Xing-Sheng1,3; Nie, Zhi-Qiang (niezq@opt.ac.cn)
作者部门瞬态光学技术国家重点实验室
2017-09-01
发表期刊Guangzi Xuebao/Acta Photonica Sinica
ISSN10044213
卷号46期号:9
产权排序1
摘要

Finite element analysis model of the conduction-cooled package high power semiconductor lasers were established respectively to analyze normal stress, shear stress and displacement in reflowing process and operating process independently. With the help of analytical solution model, the cause and the distribution of thermal stress and smile were analyzed. The results show that shear stress is the origin of other thermo-mechanical behavior in reflowing process due to coefficient thermal expansion mismatch, while both coefficient thermal expansion mismatch and temperature gradient affect the thermal stress and displacement in operating process. In order to obtain the accurate result, the residual stress and displacement of reflowing process were considered as the initial condition in operating finite element analysis simulation, and the thermal stress and smile were simulated. The influence of heat sink temperature on smile was studied with finite element analysis and experiment. The result shows operating process has great impact on smile and results in worse smile, and with the rising of temperature of heat sink, smile also becomes larger. © 2017, Science Press. All right reserved.

DOI10.3788/gzxb20174609.0914001
收录类别EI ; CSCD
语种中文
引用统计
被引频次:3[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.opt.ac.cn/handle/181661/29461
专题瞬态光学研究室
通讯作者Nie, Zhi-Qiang (niezq@opt.ac.cn)
作者单位1.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an; 710119, China
2.University of Chinese Academy of Sciences, Beijing; 100049, China
3.Focuslight Technologies Inc., Xi'an; 710077, China
推荐引用方式
GB/T 7714
Lu, Yao,Nie, Zhi-Qiang,Chen, Tian-Qi,et al. Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays[J]. Guangzi Xuebao/Acta Photonica Sinica,2017,46(9).
APA Lu, Yao.,Nie, Zhi-Qiang.,Chen, Tian-Qi.,Zhang, Pu.,Xiong, Ling-Ling.,...&Nie, Zhi-Qiang .(2017).Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays.Guangzi Xuebao/Acta Photonica Sinica,46(9).
MLA Lu, Yao,et al."Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays".Guangzi Xuebao/Acta Photonica Sinica 46.9(2017).
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