Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays | |
其他题名 | 传导冷却单巴高功率半导体激光器热应力和smile研究 |
Lu, Yao1,2; Nie, Zhi-Qiang1; Chen, Tian-Qi1,2; Zhang, Pu1; Xiong, Ling-Ling1; Wu, Di-Hai1,2; Li, Xiao-Ning3; Wang, Zhen-Fu1; Liu, Xing-Sheng1,3; Nie, Zhi-Qiang (niezq@opt.ac.cn) | |
作者部门 | 瞬态光学技术国家重点实验室 |
2017-09-01 | |
发表期刊 | Guangzi Xuebao/Acta Photonica Sinica |
ISSN | 10044213 |
卷号 | 46期号:9 |
产权排序 | 1 |
摘要 | Finite element analysis model of the conduction-cooled package high power semiconductor lasers were established respectively to analyze normal stress, shear stress and displacement in reflowing process and operating process independently. With the help of analytical solution model, the cause and the distribution of thermal stress and smile were analyzed. The results show that shear stress is the origin of other thermo-mechanical behavior in reflowing process due to coefficient thermal expansion mismatch, while both coefficient thermal expansion mismatch and temperature gradient affect the thermal stress and displacement in operating process. In order to obtain the accurate result, the residual stress and displacement of reflowing process were considered as the initial condition in operating finite element analysis simulation, and the thermal stress and smile were simulated. The influence of heat sink temperature on smile was studied with finite element analysis and experiment. The result shows operating process has great impact on smile and results in worse smile, and with the rising of temperature of heat sink, smile also becomes larger. © 2017, Science Press. All right reserved. |
DOI | 10.3788/gzxb20174609.0914001 |
收录类别 | EI ; CSCD |
语种 | 中文 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/29461 |
专题 | 瞬态光学研究室 |
通讯作者 | Nie, Zhi-Qiang (niezq@opt.ac.cn) |
作者单位 | 1.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an; 710119, China 2.University of Chinese Academy of Sciences, Beijing; 100049, China 3.Focuslight Technologies Inc., Xi'an; 710077, China |
推荐引用方式 GB/T 7714 | Lu, Yao,Nie, Zhi-Qiang,Chen, Tian-Qi,et al. Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays[J]. Guangzi Xuebao/Acta Photonica Sinica,2017,46(9). |
APA | Lu, Yao.,Nie, Zhi-Qiang.,Chen, Tian-Qi.,Zhang, Pu.,Xiong, Ling-Ling.,...&Nie, Zhi-Qiang .(2017).Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays.Guangzi Xuebao/Acta Photonica Sinica,46(9). |
MLA | Lu, Yao,et al."Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays".Guangzi Xuebao/Acta Photonica Sinica 46.9(2017). |
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传导冷却单巴高功率半导体激光器热应力和s(4848KB) | 期刊论文 | 出版稿 | 限制开放 | CC BY-NC-SA | 请求全文 |
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