中文版 | English

在结果中检索

OPT OpenIR
（本次检索基于用户作品认领结果）

浏览/检索结果: 共9条，第1-9条 帮助

限定条件            
已选(0)清除 条数/页：   排序方式：
Effect of submount thickness on near-field bowing of laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 28, 页码: 8407-8411
作者:  Zhang, Hongyou;  Chen, Tianqi;  Zhang, Pu;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1049Kb)  |  收藏  |  浏览/下载：173/3  |  提交时间：2018/11/02
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：244/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：240/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions 期刊论文
MICROELECTRONICS RELIABILITY, 2015, 卷号: 55, 期号: 12, 页码: 2532-2541
作者:  Yan, Haidong;  Mei, Yunhui;  Li, Xin;  Zhang, Pu;  Lu, Guo-Quan;  Mei, YH
Adobe PDF(2559Kb)  |  收藏  |  浏览/下载：249/1  |  提交时间：2015/12/02
Nanosilver Paste  Laser Module  Die-attach Interface  Pulse Mode  Reliability  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：231/1  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：212/0  |  提交时间：2015/12/04
Hard solder 20kW QCW Stack Array Diode Laser 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Xiaoning Li;  Lijun Kang;  Jingwei Wang;  Pu Zhang;  Lingling Xiong;  Xingsheng Liu
Adobe PDF(1026Kb)  |  收藏  |  浏览/下载：696/3  |  提交时间：2013/01/16
High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology 会议论文
High-Power Diode Laser Technology and Applications X, San Francisco, CA, United states, January 22, 2012 - January 24, 2012
作者:  Wang, Jingwei;  Kang, Lijun;  Zhang, Pu;  Nie, Zhiqiang;  Li, Xiaoning;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(2099Kb)  |  收藏  |  浏览/下载：515/1  |  提交时间：2013/03/08
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Zhiyong Zhang;  Pu Zhang;  Xiaoning Li;  Lingling Xiong;  Hui Liu;  Zhiqiang Nie;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(1758Kb)  |  收藏  |  浏览/下载：385/0  |  提交时间：2013/06/26