Thermal modeling and analysis of high power semiconductor laser arrays

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	Thermal modeling and analysis of high power semiconductor laser arrays
	Zhiyong Zhang; Pu Zhang; Xiaoning Li; Lingling Xiong; Hui Liu; Zhiqiang Nie; Zhenfu Wang; Xingsheng Liu
	2012
会议名称	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
会议录名称	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
页码	560-566
会议日期	August 13, 2012 - August 16, 2012
会议地点	Guilin, China
出版地	2001 L Street N.W., Suite 700, Washington, DC 20036-4928, United States
出版者	IEEE Computer Society
产权排序	1
摘要	With the continuous increase of the output power of semiconductor laser array, the heat generation in the active region also increases continuously, which influences the performances and lifetime of semiconductor laser array seriously. In order to improve the performances and lifetime, understanding of the thermal behavior of high power semiconductor laser array packages and optimizing the thermal performance are crucial. By means of numerical analysis, a three-dimensional thermal model has been established, and the static and transient thermal characteristics in continuous-wave (CW) and quasi-continuous-wave (QCW) modes also have been studied systematically for a hard solder, conduction-cooled-packaged 808nm semiconductor laser array. Based on the thermal modeling and analysis, the approaches to reduce thermal resistance have been proposed. The results show that: compared with copper-tungsten (CuW), adopting the copper-diamond composite material as the submount can decrease the thermal crosstalk behavior between emitters, and reduce the thermal resistance by about 30%. In addition, a novel thermal design for the packaging structure of the mounting heat-sink is demonstrated, which has the ability of reducing the thermal resistance of the devices significantly.
作者部门	瞬态光学技术国家重点实验室
收录类别	EI
ISBN号	9781467316804
语种	英语
文献类型	会议论文
条目标识符	http://ir.opt.ac.cn/handle/181661/20812
专题	瞬态光学研究室
推荐引用方式 GB/T 7714	Zhiyong Zhang,Pu Zhang,Xiaoning Li,et al. Thermal modeling and analysis of high power semiconductor laser arrays[C]. 2001 L Street N.W., Suite 700, Washington, DC 20036-4928, United States:IEEE Computer Society,2012:560-566.

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