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High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
浏览  |  Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：251/1  |  提交时间：2018/04/25
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
浏览  |  Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：263/2  |  提交时间：2018/04/25
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
浏览  |  Adobe PDF(667Kb)  |  收藏  |  浏览/下载：367/2  |  提交时间：2017/07/06
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
浏览  |  Adobe PDF(965Kb)  |  收藏  |  浏览/下载：195/1  |  提交时间：2017/05/27
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
浏览  |  Adobe PDF(594Kb)  |  收藏  |  浏览/下载：214/1  |  提交时间：2017/06/08
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
浏览  |  Adobe PDF(651Kb)  |  收藏  |  浏览/下载：183/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
浏览  |  Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：235/0  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
浏览  |  Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：226/0  |  提交时间：2015/12/04
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：379/1  |  提交时间：2017/07/18
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2012, 卷号: 134, 期号: 4, 页码: 041003
作者:  Yan, Yi;  Chen, Xu;  Liu, Xingsheng;  Mei, Yunhui;  Lu, Guo-Quan
Adobe PDF(1975Kb)  |  收藏  |  浏览/下载：234/0  |  提交时间：2013/10/11
Nanosilver Paste  Laser Diodes  Die Bonding