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Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：304/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：249/1  |  提交时间：2018/04/25
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：228/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：291/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：226/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：233/0  |  提交时间：2015/12/04
Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Wang, Jingwei;  Li, Xiaoning;  Feng, Feifei;  Liu, Yalong;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(476Kb)  |  收藏  |  浏览/下载：185/0  |  提交时间：2015/12/04
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：378/1  |  提交时间：2017/07/18
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2012, 卷号: 134, 期号: 4, 页码: 041003
作者:  Yan, Yi;  Chen, Xu;  Liu, Xingsheng;  Mei, Yunhui;  Lu, Guo-Quan
Adobe PDF(1975Kb)  |  收藏  |  浏览/下载：233/0  |  提交时间：2013/10/11
Nanosilver Paste  Laser Diodes  Die Bonding  
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：269/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging