Influence of Package Structure on the Performance of the Single Emitter Diode Laser

doi:10.1109/TCPMT.2012.2207456

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	Influence of Package Structure on the Performance of the Single Emitter Diode Laser
	Li, Xiaoning 1,2; Zhang, Yanxin 1,3; Wang, Jingwei 1,3; Xiong, Lingling 1,3; Zhang, Pu1,3 ; Nie, Zhiqiang1,3 ; Wang, Zhenfu 1,3; Liu, Hui 1,3; Liu, Xingsheng 1,3
作者部门	炬光科技有限公司
	2012-10-01
发表期刊	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN	2156-3950
卷号	2 期号:10 页码:1592-1599
产权排序	1
摘要	The package structure critically influences the major characteristics of semiconductor lasers, such as thermal behavior, output power, wavelength, and far-field distribution. In this paper, a new single emitter package structure called F-mount is designed and compared with the conventional package structure C-mount. The influence of package structure on their performances is characterized and analyzed. The thermal resistances of lasers with different package structures are calculated through simulation, and are contrasted with experimental results. Some devices are also tested for the maximum output power level. Under the continuous wave (CW) condition, the maximum power of F-mount reaches 12.6 W at 808 nm while the output power only reaches 10.9 W for C-mount. Under the condition of 0.5% duty cycle (100 mu s, 50 Hz), the catastrophic optical mirror damage level reaches 58.7 W at 74 A for F-mount, and 54.8 W at 57 A for C-mount are reported for the first time. It is experimentally found that there is an obvious wavelength difference between the two type structure lasers: about 1.37 nm in CW mode and 2.89 nm in quasi CW mode. Theoretical analysis shows that red-shift and blue-shift is a result of external strain in the package process of F-mount and C-mount, respectively. It is also found that the package structure has an effect on the divergence angle of slow axis far fields, but little impact on that of fast axis far fields. The analysis shows that package structure has a strong influence on the performance of the laser; therefore, the package should be optimized to achieve better performance for some special applications.
文章类型	Article
关键词	Component Architectures Semiconductor Device Packaging
WOS标题词	Science & Technology ; Technology
DOI	10.1109/TCPMT.2012.2207456
收录类别	SCI ; EI
关键词[WOS]	POWER SEMICONDUCTOR-LASERS ; INDIUM ; STRAIN
语种	英语
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS记录号	WOS:000309729400004
引用统计	被引频次：14[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.opt.ac.cn/handle/181661/20937
专题	炬光科技有限公司
作者单位	1.Chinese Acad Sci, Xian Inst Opt & Precis Mech, Xian 710119, Peoples R China 2.Xi An Jiao Tong Univ, Xian 710049, Peoples R China 3.Xian Focuslight Technol Co Ltd, Xian 710119, Peoples R China
推荐引用方式 GB/T 7714	Li, Xiaoning,Zhang, Yanxin,Wang, Jingwei,et al. Influence of Package Structure on the Performance of the Single Emitter Diode Laser[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2012,2(10):1592-1599.
APA	Li, Xiaoning.,Zhang, Yanxin.,Wang, Jingwei.,Xiong, Lingling.,Zhang, Pu.,...&Liu, Xingsheng.(2012).Influence of Package Structure on the Performance of the Single Emitter Diode Laser.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2(10),1592-1599.
MLA	Li, Xiaoning,et al."Influence of Package Structure on the Performance of the Single Emitter Diode Laser".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2.10(2012):1592-1599.

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