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X-ray transmission effects in a high-density dynamic-dusty plasma environment 期刊论文
VACUUM, 2023, 卷号: 212
作者:  Li, Yao;  Yang, Zhiqiang;  Zhang, Yingjun;  Chen, Mingde;  Xia, Fangyuan;  Yang, Lihong;  Zhang, Furui;  Wu, Yinhua;  Tan, Zhenkun;  Yang, Chen;  Su, Tong
Adobe PDF(11679Kb)  |  收藏  |  浏览/下载：79/0  |  提交时间：2023/07/13
X-ray communication  Dynamic -dusty plasma  Pulse X-rays  Bit error ratio  
Detail enhancement for infrared image based on Iterative least squares and difference of Gaussian filter 会议论文
Third International Computing Imaging Conference, CITA 2023, Sydney, NSW, Australia, 2023-06-01
作者:  Chen, Zhiqiang;  Zhao, Zehao;  Guan, Lei;  Zhou, Feng;  Chen, Yaohong
Adobe PDF(2016Kb)  |  收藏  |  浏览/下载：33/0  |  提交时间：2023/12/26
Infrared image enhancement  Least squares  Noise suppression  High dynamic range  
基于生成对抗网络的红外和可见光图像融合技术研究 学位论文
, 北京: 中国科学院大学, 2022
作者:  姚志强
Adobe PDF(8375Kb)  |  收藏  |  浏览/下载：121/0  |  提交时间：2022/06/14
图像融合  生成对抗网络  注意力机制  海思嵌入式平台  
An improved fusion method of infrared and visible images based on fusionGAN 会议论文
Thirteenth International Conference on Digital Image Processing, ICDIP 2021, Singapore, Singapore, 2021-05-20
作者:  Yao, Zhiqiang;  Guo, Huinan;  Ren, Long
Adobe PDF(1048Kb)  |  收藏  |  浏览/下载：272/0  |  提交时间：2021/07/26
Image fusion  FusionGAN  Pyramid network  Residual network  Infrared image  Visible image  
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays 期刊论文
Guangzi Xuebao/Acta Photonica Sinica, 2017, 卷号: 46, 期号: 9
作者:  Lu, Yao;  Nie, Zhi-Qiang;  Chen, Tian-Qi;  Zhang, Pu;  Xiong, Ling-Ling;  Wu, Di-Hai;  Li, Xiao-Ning;  Wang, Zhen-Fu;  Liu, Xing-Sheng;  Nie, Zhi-Qiang (niezq@opt.ac.cn)
Unknown(4848Kb)  |  收藏  |  浏览/下载：193/2  |  提交时间：2017/12/30
一种半导体激光测距光学系统及测距仪 专利
专利类型: 发明申请, 专利号: CN106249247A, 申请日期: 2016-12-21, 公开日期: 2016-12-21
发明人:  孙志强;  朱小龙;  杨耀富
Adobe PDF(171Kb)  |  收藏  |  浏览/下载：47/0  |  提交时间：2020/01/18
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：218/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：359/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties