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Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：243/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays 期刊论文
Guangzi Xuebao/Acta Photonica Sinica, 2017, 卷号: 46, 期号: 9
作者:  Lu, Yao;  Nie, Zhi-Qiang;  Chen, Tian-Qi;  Zhang, Pu;  Xiong, Ling-Ling;  Wu, Di-Hai;  Li, Xiao-Ning;  Wang, Zhen-Fu;  Liu, Xing-Sheng;  Nie, Zhi-Qiang (niezq@opt.ac.cn)
Unknown(4848Kb)  |  收藏  |  浏览/下载：194/2  |  提交时间：2017/12/30
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：218/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
大功率半导体激光器阵列热串扰行为 期刊论文
强激光与粒子束, 2013, 期号: 8, 页码: 1904-1910
作者:  张志勇;  张普;  聂志强;  李小宁;  熊玲玲;  刘晖;  王贞福;  刘兴胜
Adobe PDF(957Kb)  |  收藏  |  浏览/下载：350/2  |  提交时间：2014/09/17
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging  
High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology 会议论文
High-Power Diode Laser Technology and Applications X, San Francisco, CA, United states, January 22, 2012 - January 24, 2012
作者:  Wang, Jingwei;  Kang, Lijun;  Zhang, Pu;  Nie, Zhiqiang;  Li, Xiaoning;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(2099Kb)  |  收藏  |  浏览/下载：514/1  |  提交时间：2013/03/08
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Zhiyong Zhang;  Pu Zhang;  Xiaoning Li;  Lingling Xiong;  Hui Liu;  Zhiqiang Nie;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(1758Kb)  |  收藏  |  浏览/下载：384/0  |  提交时间：2013/06/26