中文版 | English

在结果中检索

OPT OpenIR

浏览/检索结果: 共13条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：367/2  |  提交时间：2017/07/06
A universal pedestrian's foot-point and head-point recognition with improved motion detection algorithm 会议论文
2017 2nd International Conference on Image, Vision and Computing, ICIVC 2017, Chengdu, China, 2017-06-02
作者:  Shi, Liu;  Liu, Jiahang;  Yihao, Wang
Adobe PDF(16909Kb)  |  收藏  |  浏览/下载：179/0  |  提交时间：2017/12/28
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：214/1  |  提交时间：2017/06/08
Stand-off laser Raman spectroscopy and its advancement in explosives detection 会议论文
AOPC 2017: Optical Spectroscopy and Imaging, Beijing, China, 2017-06-04
作者:  Liu, Sheng-Run;  Xue, Bin;  Li, Yi-Zhe;  Wang, Hui
Adobe PDF(581Kb)  |  收藏  |  浏览/下载：224/1  |  提交时间：2018/03/07
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Influence of absorption on stability of terahertz difference frequency generation 期刊论文
APPLIED OPTICS, 2016, 卷号: 55, 期号: 3, 页码: 444-448
作者:  Huang, Nan;  Liu, Hongjun;  Sun, Qibing;  Wang, Zhaolu;  Li, Shaopeng;  Han, Jing;  Liu, HJ
Adobe PDF(703Kb)  |  收藏  |  浏览/下载：258/2  |  提交时间：2016/02/19
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：228/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Adaptive retinex algorithm based on genetic algorithm and human visual system 会议论文
Proceedings - 2016 8th International Conference on Intelligent Human-Machine Systems and Cybernetics, IHMSC 2016, Hangzhou, Zhejiang, China, 2016-09-11
作者:  Song, Xiaodong;  Zhou, Zuofeng;  Guo, Huinan;  Zhao, Xiaodong;  Zhang, Hui
Adobe PDF(563Kb)  |  收藏  |  浏览/下载：202/1  |  提交时间：2017/03/24
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：235/0  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：226/0  |  提交时间：2015/12/04