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Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：177/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress 期刊论文
OPTICAL ENGINEERING, 2020, 卷号: 59, 期号: 3
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1418Kb)  |  收藏  |  浏览/下载：190/2  |  提交时间：2020/04/27
thermal  induced stress  diode laser arrays  near-field bowing  SMILE  
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1435Kb)  |  收藏  |  浏览/下载：177/1  |  提交时间：2020/05/18
High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：182/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 24, 页码: 6672-6677
作者:  Zhang, Hongyou;  Fu, Tuanwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(794Kb)  |  收藏  |  浏览/下载：199/3  |  提交时间：2019/09/02
A porous Au-Ag hybrid nanoparticle array with broadband absorption and high-density hotspots for stable SERS analysis 期刊论文
Nanoscale, 2019, 卷号: 11, 期号: 19, 页码: 9587-9592
作者:  Li, Kuanguo;  Liu, Guangju;  Zhang, Sheng;  Dai, Yanqiu;  Ghafoor, Sonia;  Huang, Wanxia;  Zu, Zewen;  Lu, Yonghua
Adobe PDF(911Kb)  |  收藏  |  浏览/下载：164/2  |  提交时间：2019/06/28
Multidimensional Manipulation of Photonic Spin Hall Effect with a Single-Layer Dielectric Metasurface 期刊论文
ADVANCED OPTICAL MATERIALS, 2019, 卷号: 7, 期号: 5
作者:  Li, Siqi;  Li, Xingyi;  Wang, Guoxi;  Liu, Sheng;  Zhang, Lingxuan;  Zeng, Chao;  Wang, Leiran;  Sun, Qibing;  Zhao, Wei;  Zhang, Wenfu
Adobe PDF(2034Kb)  |  收藏  |  浏览/下载：252/6  |  提交时间：2019/04/12
dynamic phase  Pancharatnam-Berry phase  photonic spin Hall effect  spin-orbit interactions  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：127/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：151/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
Effect of submount thickness on near-field bowing of laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 28, 页码: 8407-8411
作者:  Zhang, Hongyou;  Chen, Tianqi;  Zhang, Pu;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1049Kb)  |  收藏  |  浏览/下载：185/3  |  提交时间：2018/11/02