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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：26/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
Modeling 3D sliding electrical contact considering fully coupled thermal-mechanical-electrical effects 期刊论文
TRIBOLOGY INTERNATIONAL, 2023, 卷号: 184
作者:  Sui, Yijin;  Wang, Wenzhong;  Zhang, Haibo;  Xie, Youjin
Adobe PDF(8860Kb)  |  收藏  |  浏览/下载：117/0  |  提交时间：2023/05/19
Sliding electrical contact  Thermal-mechanical-electrical coupling  Electrical constriction resistance  Electric potential equilibrium  
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：160/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
Thermal design for the package of high-power single-emitter laser diodes 期刊论文
Optics and Laser Technology, 2020, 卷号: 129
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(6158Kb)  |  收藏  |  浏览/下载：212/2  |  提交时间：2020/05/14
High-power laser diodes  Thermal design  Thermal resistance  Heat sink  Submount  Heat spreading angle  
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：128/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
Adobe PDF(2834Kb)  |  收藏  |  浏览/下载：240/1  |  提交时间：2018/12/03
Electricity  Electronic Packaging  Joining Process  Nanoporous Materials  Thermal Resistance  
Modulated photothermal reflectance technique for measuring thermal conductivity of nano film on substrate and thermal boundary resistance 期刊论文
THIN SOLID FILMS, 2008, 卷号: 516, 期号: 23, 页码: 8359-8362
作者:  Bu, W. F.;  Tang, D. W.;  Wang, Z. L.;  Zheng, X. H.;  Cheng, G. H.
Adobe PDF(330Kb)  |  收藏  |  浏览/下载：290/1  |  提交时间：2011/09/30
Photothermal Reflectance Technique  Interface Thermal Resistance  Simulation Annealing Algorithm  Thermal Conductivity  Nano Film  Silicon Dioxide  Thin Films  Thermal Boundary Resistance