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Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：205/2  |  提交时间：2017/06/08
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：343/2  |  提交时间：2017/07/06
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：250/2  |  提交时间：2017/06/08
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：231/1  |  提交时间：2015/12/04
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Zhang, Pu;  Wang, Jingwei;  Xiong, Lingling;  Li, Xiaoning;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(624Kb)  |  收藏  |  浏览/下载：198/1  |  提交时间：2015/12/04
A 3000W 808nm QCW G-Stack Semiconductor Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Zhang, Pu;  Wang, Jingwei;  Hou, Dong;  Wang, Zhenfu;  Xiong, Ling Ling;  Liu, Hui;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(355Kb)  |  收藏  |  浏览/下载：212/2  |  提交时间：2015/12/04