Thermal characteristics of compact conduction-cooled high power diode laser array packages | |
Zhang, Pu1; Liu, Xingsheng1,2; Zhu, Qiwen1; Wang, Jingwei2 | |
2017 | |
会议名称 | Components and Packaging for Laser Systems III 2017 |
会议录名称 | Components and Packaging for Laser Systems III 2017 |
卷号 | 10085 |
会议日期 | 2017-01-31 |
会议地点 | San Francisco, CA, United states |
出版者 | SPIE |
产权排序 | 1 |
摘要 | Thermal management is one of the most important factors affecting the performance of high power diode lasers. In this paper, transient thermal behavior of conduction-cooled high power diode lasers has been studied using finite element method. The effects of heat sink geometry, ceramics size on the junction temperature of high power diode laser packages have been analyzed. Based on the simulations, heat dissipation capability of high power diode laser packages is improved and compact conduction-cooled diode laser array packages with 3 bars and 5 bars are fabricated. The power ∼ current and spectrum of the optimized high power diode laser array packages at different operation parameters are characterized at different pulse widths, repetition frequencies and TEC temperatures. The effects of temperature on the output power and spectrum are discussed. The lifetime test of high power diode laser array packages is also performed. It shows that the conduction-cooled high power diode laser array packages have good optical performance. © 2017 SPIE. |
作者部门 | 瞬态光学技术国家重点实验室 |
DOI | 10.1117/12.2250258 |
收录类别 | EI ; ISTP |
ISBN号 | 9781510606111 |
语种 | 英语 |
ISSN号 | 0277786X |
引用统计 | |
文献类型 | 会议论文 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/28954 |
专题 | 瞬态光学研究室 |
作者单位 | 1.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an Hi-Tech Industrial Development Zone, No. 17 Xinxi Road, New Industrial Park, Xi'an, Shaanxi; 710119, China 2.Focuslight Technologies Co., LTD, Xi'an Hi-Tech Industrial Development Zone, No. 60 Xibu Road, New Industrial Park, Xi'an, Shaanxi; 710119, China |
推荐引用方式 GB/T 7714 | Zhang, Pu,Liu, Xingsheng,Zhu, Qiwen,et al. Thermal characteristics of compact conduction-cooled high power diode laser array packages[C]:SPIE,2017. |
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文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
Thermal characterist(768KB) | 会议论文 | 限制开放 | CC BY-NC-SA | 请求全文 |
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