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A High-Performance Annularly Stacked Laser Diode Pump 会议论文
SEMICONDUCTOR LASERS AND APPLICATIONS X, ELECTR NETWORK, 2020-10-12
作者:  Li, Junli;  Sun, Lichen;  Liu, Ming;  Han, Yang;  Fu, Tuanwei;  Cai, Lei;  Zheng, Yanfang;  Yan, Minna;  Wang, Juan;  Tao, Chunhua;  Gao, Lijun;  Wang, Jingwei;  Zah, Chung-en;  Liu, Xingsheng
Adobe PDF(941Kb)  |  收藏  |  浏览/下载：165/2  |  提交时间：2021/04/15
high peak power  annular stack  macro channel  uniformity of centroid wavelength  
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：282/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Fan, Yingmin;  Wang, Jingwei;  Cai, Lei;  Mitra, Thomas;  Hauschild, Dirk;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(5638Kb)  |  收藏  |  浏览/下载：464/2  |  提交时间：2018/04/25
High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2018/04/25
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：255/2  |  提交时间：2018/04/25
Quasi-CW performance and reliability of dual laser bars on a micro-channel cooler 会议论文
High-Power Lasers and Applications IX, Beijing, China, 2018-10-11
作者:  Zhang, Hongyou;  Chen, Li;  Zhao, Sen;  Wang, Boxue;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：97/0  |  提交时间：2019/03/12
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：248/2  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：278/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature