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Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long;  Yang, Yingkun;  Mei, Yunhui (yunhui@tju.edu.cn)
Adobe PDF(1037Kb)  |  收藏  |  浏览/下载：224/1  |  提交时间：2017/07/18
Reconfigurable microwave photonic transversal filter based on an integrated Kerr comb 会议论文
Nanophotonics Australasia 2017, Melbourne, VIC, Australia, 2017-12-10
作者:  Xu, Xingyuan;  Wu, Jiayang;  Nguyen, Thach G.;  Shoeiby, Mehrdad;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.
Adobe PDF(872Kb)  |  收藏  |  浏览/下载：131/1  |  提交时间：2018/03/07
Brownian dynamics of the optically trapped spinning microparticles in low pressures 会议论文
AOPC 2017: Optoelectronics and Micro/Nano-Optics, Beijing, China, 2017-06-04
作者:  Lang, Mengjiao;  Xiong, Wei;  Xiao, Guangzong;  Han, Xiang;  Tang, Jianxun;  Xiao, Guangzong (xiaoguangzong@nudt.edu.cn)
Adobe PDF(579Kb)  |  收藏  |  浏览/下载：374/0  |  提交时间：2018/02/11
Simple and fast spectral domain algorithm for quantitative phase imaging of living cells with digital holographic microscopy 会议论文
THREE-DIMENSIONAL AND MULTIDIMENSIONAL MICROSCOPY: IMAGE ACQUISITION AND PROCESSING XXIV, San Francisco, CA, 2017-01-30
作者:  Min, Junwei;  Yao, Baoli;  Ketelhut, Steffi;  Kemper, Bjoern;  Kemper, B (reprint author), Univ Munster, Biomed Technol Ctr, Mendelstr 17, D-48149 Munster, Germany.
Adobe PDF(1076Kb)  |  收藏  |  浏览/下载：190/0  |  提交时间：2017/09/07
Digital Holographic Microscopy  Aberration Compensation  Frequency Spectrum Analysis  Quantitative Phase Imaging  Quantitative Live Cell Analysis  
Highly Polarized Multiwavelength Er-doped Fibre Laser Using All Fibre Lyot Filter 会议论文
2017 16TH INTERNATIONAL CONFERENCE ON OPTICAL COMMUNICATIONS & NETWORKS (ICOCN 2017), Wuzhen, PEOPLES R CHINA, 2017-08-07
作者:  Zhao, Zihao;  Li, Yue;  Yan, Zhijun;  Luo, Yiyang;  Wang, Hushan;  Sun, Qizhen;  Liu, Deming;  Zhang, Lin;  Yan, ZJ (reprint author), Huazhong Univ Sci & Technol, Sch Opt & Elect Informat, Natl Engn Lab Next Generat Internet Access Syst, Wuhan 430074, Hubei, Peoples R China.
Adobe PDF(1322Kb)  |  收藏  |  浏览/下载：184/0  |  提交时间：2018/03/28
Fiber Laser  Polarization  Lyot Filter  
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：343/2  |  提交时间：2017/07/06
Integrated Kerr comb-based reconfigurable transversal differentiator for microwave photonic signal processing（SPIE） 会议论文
NANOPHOTONICS AUSTRALASIA 2017, Melbourne, AUSTRALIA, 2017-12-10
作者:  Xu, Xingyuan;  Wu, Jiayang;  Shoeiby, Mehrdad;  Nguyen, Thach G.;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.;  Moss, DJ (reprint author), Swinburne Univ Technol, Ctr Microphoton, Hawthorn, Vic 3122, Australia.
Adobe PDF(900Kb)  |  收藏  |  浏览/下载：185/1  |  提交时间：2018/03/28
Optical Frequency Combs  Micro-ring Resonator  Optical Signal Processing  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：241/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：280/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control