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D-shaped terahertz microstructured fiber biosensor based on plasmon resonance on graphene surface 会议论文
2023 21st International Conference on Optical Communications and Networks, ICOCN 2023, Qufu, China, 2023-07-31
作者:  Zhang, Yani;  Xue, Jia;  Zhang, Yunxia;  Miao, Ting;  Yao, Yiming;  Wang, Qiuyang;  Gong, Jiaqin
Adobe PDF(838Kb)  |  收藏  |  浏览/下载：55/1  |  提交时间：2023/10/26
terahertz  microstructure fiber  surface plasmon resonance  fiber sensor  graphene  
A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：90/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：163/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
Research on ultra-smooth collimation separation of silicon wafer by multiple lasers 会议论文
Proceedings - 2020 3rd International Conference on Electron Device and Mechanical Engineering, ICEDME 2020, Suzhou, China, 2020-05-01
作者:  Youwang, Hu;  Ming, Li;  Qinqin, Xie;  Xiaoyan, Sun
Adobe PDF(328Kb)  |  收藏  |  浏览/下载：114/1  |  提交时间：2020/07/28
silicon wafer  laser  thermal cracking  prefabricated crack  
A High-Performance Annularly Stacked Laser Diode Pump 会议论文
SEMICONDUCTOR LASERS AND APPLICATIONS X, ELECTR NETWORK, 2020-10-12
作者:  Li, Junli;  Sun, Lichen;  Liu, Ming;  Han, Yang;  Fu, Tuanwei;  Cai, Lei;  Zheng, Yanfang;  Yan, Minna;  Wang, Juan;  Tao, Chunhua;  Gao, Lijun;  Wang, Jingwei;  Zah, Chung-en;  Liu, Xingsheng
Adobe PDF(941Kb)  |  收藏  |  浏览/下载：168/2  |  提交时间：2021/04/15
high peak power  annular stack  macro channel  uniformity of centroid wavelength  
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：129/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：137/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：119/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Linear space-variant optical cryptosystem via Fourier ptychography 会议论文
Progress in Biomedical Optics and Imaging - Proceedings of SPIE, San Francisco, CA, United states, 2019-02-02
作者:  Pan, An;  Wen, Kai;  Yao, Baoli
Adobe PDF(14203Kb)  |  收藏  |  浏览/下载：168/1  |  提交时间：2019/07/08
Fourier optics and signal processing  Computational imaging  Pattern recognition  optical security and encryption  Fourier ptychography  
High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2018/04/25