| Research on ultra-smooth collimation separation of silicon wafer by multiple lasers | |
| Youwang, Hu1; Ming, Li2; Qinqin, Xie1; Xiaoyan, Sun1 | |
| 2020-05 | |
| 会议名称 | 3rd International Conference on Electron Device and Mechanical Engineering, ICEDME 2020 |
| 会议录名称 | Proceedings - 2020 3rd International Conference on Electron Device and Mechanical Engineering, ICEDME 2020 |
| 页码 | 454-457 |
| 会议日期 | 2020-05-01 |
| 会议地点 | Suzhou, China |
| 出版者 | Institute of Electrical and Electronics Engineers Inc. |
| 产权排序 | 2 |
| 摘要 | Micro-cracks are prefabricated on the surface of the silicon wafer, and laser thermal cracking is used to dice the silicon wafer, which can greatly reduce the surface roughness of the cross section of the wafer, improve the straightness after cutting, and achieve high-quality dicing of silicon wafers. This is a new dicing technology with huge application value. © 2020 IEEE. |
| 关键词 | silicon wafer laser thermal cracking prefabricated crack |
| 作者部门 | 瞬态光学研究室 |
| DOI | 10.1109/ICEDME50972.2020.00109 |
| 收录类别 | EI |
| ISBN号 | 9781728181455 |
| 语种 | 英语 |
| EI入藏号 | 20202908946740 |
| 引用统计 | |
| 文献类型 | 会议论文 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/93591 |
| 专题 | 瞬态光学研究室 |
| 通讯作者 | Xiaoyan, Sun |
| 作者单位 | 1.Central South University, State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Changsha, China; 2.Xi'An Institute of Optics and Precision Mechanics of CAS, State Key Laboratory of Transient Optics and Photonics, Xi'an, Shanxi; 710119, China |
| 推荐引用方式 GB/T 7714 | Youwang, Hu,Ming, Li,Qinqin, Xie,et al. Research on ultra-smooth collimation separation of silicon wafer by multiple lasers[C]:Institute of Electrical and Electronics Engineers Inc.,2020:454-457. |
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| 文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
| Research on ultra-sm（328KB） | 会议论文 | 限制开放 | CC BY-NC-SA | 请求全文 | ||
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