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High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：172/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：288/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：119/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：138/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：255/2  |  提交时间：2018/04/25
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：221/0  |  提交时间：2015/12/04