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高功率半导体激光器低温特性分析 期刊论文
光子学报, 2019, 卷号: 48, 期号: 9
作者:  王明培;  张普;  聂志强;  刘晖;  孙玉博;  吴的海;  赵宇亮
Adobe PDF(3546Kb)  |  收藏  |  浏览/下载：241/2  |  提交时间：2019/10/28
半导体激光器  光电测量  低温冷却  微通道  输出功率  电光转换效率  
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：132/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：241/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：371/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：280/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Slow axis collimation lens with variable curvature radius for semiconductor laser bars 期刊论文
OPTICS AND LASER TECHNOLOGY, 2016, 卷号: 77, 页码: 1-5
作者:  Xiong, Ling-Ling;  Cai, Lei;  Zheng, Yan-Fang;  Liu, Hui;  Zhang, Pu;  Nie, Zhi-Qiang;  Liu, Xing-Sheng;  Liu, XS
Adobe PDF(600Kb)  |  收藏  |  浏览/下载：277/1  |  提交时间：2016/01/11
Semiconductor Laser  Variable Curvature Radius  Slow Axis Collimation Lens  Constant Phase Front  Transmission Angle  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
A 3000W 808nm QCW G-Stack Semiconductor Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Zhang, Pu;  Wang, Jingwei;  Hou, Dong;  Wang, Zhenfu;  Xiong, Ling Ling;  Liu, Hui;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(355Kb)  |  收藏  |  浏览/下载：212/2  |  提交时间：2015/12/04
Double-cutting beam shaping technique for high-power diode laser area light source 期刊论文
OPTICAL ENGINEERING, 2013, 卷号: 52, 期号: 10
作者:  Huang, Zhihua;  Xiong, Lingling;  Liu, Hui;  Wang, Zhenfu;  Zhang, Pu;  Nie, Zhiqiang;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2938Kb)  |  收藏  |  浏览/下载：340/1  |  提交时间：2014/09/17
Beam Shaping  Beam Parameter Product  Laser Diode  Fiber Coupling  
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：258/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging