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Design of cryogenic long-wave infrared detection system 会议论文
Journal of Physics: Conference Series, Chengdu, China, 2021-10-30
作者:  Hongwei, Zhang;  Weining, Chen;  Rui, Qu;  Yingjun, Ma;  Yalin, Ding;  Haifeng, Xu
Adobe PDF(634Kb)  |  收藏  |  浏览/下载：95/0  |  提交时间：2022/08/29
A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：102/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
Research progress and core technologies of optical-mechanical system based on additive manufacturing 会议论文
AOPC 2021: Advanced Laser Technology and Applications, Beijing, China, 2021-06-20
作者:  Jia, Xinyin;  Hu, Bingliang;  Wang, Feicheng;  Li, Siyuan;  Sun, Lijun;  Wu, Junqiang
Adobe PDF(931Kb)  |  收藏  |  浏览/下载：110/1  |  提交时间：2022/01/30
optical-mechanical system  additive manufacturing  Voronoi cells  surface modification process  
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：177/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1435Kb)  |  收藏  |  浏览/下载：176/1  |  提交时间：2020/05/18
High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：181/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：135/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：145/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：248/1  |  提交时间：2018/04/25
Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：211/2  |  提交时间：2017/06/08