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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：33/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
C- and L-Bands Wavelength-Tunable Mode-Locked Fiber Laser 期刊论文
PHOTONICS, 2023, 卷号: 10, 期号: 12
作者:  Lang, Jiajing;  Chen, Cheng;  Zhang, Pu;  Qi, Mei;  Chen, Haowei
Adobe PDF(2427Kb)  |  收藏  |  浏览/下载：35/1  |  提交时间：2024/01/24
mode-locked  wavelength tunable  C- and L-bands  
Effect of submount thickness on near-field bowing of laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 28, 页码: 8407-8411
作者:  Zhang, Hongyou;  Chen, Tianqi;  Zhang, Pu;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1049Kb)  |  收藏  |  浏览/下载：179/3  |  提交时间：2018/11/02
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：251/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Slow axis collimation lens with variable curvature radius for semiconductor laser bars 期刊论文
OPTICS AND LASER TECHNOLOGY, 2016, 卷号: 77, 页码: 1-5
作者:  Xiong, Ling-Ling;  Cai, Lei;  Zheng, Yan-Fang;  Liu, Hui;  Zhang, Pu;  Nie, Zhi-Qiang;  Liu, Xing-Sheng;  Liu, XS
Adobe PDF(600Kb)  |  收藏  |  浏览/下载：283/1  |  提交时间：2016/01/11
Semiconductor Laser  Variable Curvature Radius  Slow Axis Collimation Lens  Constant Phase Front  Transmission Angle  
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions 期刊论文
MICROELECTRONICS RELIABILITY, 2015, 卷号: 55, 期号: 12, 页码: 2532-2541
作者:  Yan, Haidong;  Mei, Yunhui;  Li, Xin;  Zhang, Pu;  Lu, Guo-Quan;  Mei, YH
Adobe PDF(2559Kb)  |  收藏  |  浏览/下载：253/1  |  提交时间：2015/12/02
Nanosilver Paste  Laser Module  Die-attach Interface  Pulse Mode  Reliability  
Double-cutting beam shaping technique for high-power diode laser area light source 期刊论文
OPTICAL ENGINEERING, 2013, 卷号: 52, 期号: 10
作者:  Huang, Zhihua;  Xiong, Lingling;  Liu, Hui;  Wang, Zhenfu;  Zhang, Pu;  Nie, Zhiqiang;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2938Kb)  |  收藏  |  浏览/下载：343/1  |  提交时间：2014/09/17
Beam Shaping  Beam Parameter Product  Laser Diode  Fiber Coupling  
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：262/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging