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Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2012, 卷号: 134, 期号: 4, 页码: 041003
作者:  Yan, Yi;  Chen, Xu;  Liu, Xingsheng;  Mei, Yunhui;  Lu, Guo-Quan
Adobe PDF(1975Kb)  |  收藏  |  浏览/下载：229/0  |  提交时间：2013/10/11
Nanosilver Paste  Laser Diodes  Die Bonding  
Threshold characteristics analysis of one-end-pumped Yb3+-doped gain-guided and index-antiguided fiber laser 期刊论文
OPTICS AND LASER TECHNOLOGY, 2012, 卷号: 44, 期号: 3, 页码: 646-649
作者:  Qu, Yibin;  Zhu, Yonggang;  Zhou, Enyu;  Wei, Wei;  Peng, Bo
Adobe PDF(693Kb)  |  收藏  |  浏览/下载：389/1  |  提交时间：2012/09/04
Gain Guided  Index Anti-guided  Analytical Solutions  
3000W CW diode laser cladding system 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Lingling Xiong;  Min Wang;  Xiaobiao Wang;  Yanfang Zheng;  Di Wu;  Pu Zhang;  Xiaoning Li;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(7498Kb)  |  收藏  |  浏览/下载：576/1  |  提交时间：2013/01/16
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Zhiyong Zhang;  Pu Zhang;  Xiaoning Li;  Lingling Xiong;  Hui Liu;  Zhiqiang Nie;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(1758Kb)  |  收藏  |  浏览/下载：387/0  |  提交时间：2013/06/26