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中国科学院西安光学精密机械研究所机构知识库
Xi'an Institute of Optics and Precision Mechanics,CAS
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Thermally induced chirp studies on spectral broadening of semiconductor laser diode arrays
期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 20, 页码: 5599-5603
作者:
Zhang, Hongyou
;
Jia, Yangtao
;
Zah, Chung-En
;
Liu, Xingsheng
Adobe PDF(1168Kb)
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浏览/下载:239/2
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提交时间:2018/09/12
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:
Nie, Zhiqiang
;
Lu, Yao
;
Chen, Tianqi
;
Zhang, Pu
;
Wu, Dihai
;
Wang, Mingpei
;
Xiong, Lingling
;
Li, Xiaoning
;
Wang, Zhenfu
;
Liu, Xingsheng
;
Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)
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浏览/下载:283/1
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提交时间:2018/05/31
Component Architectures
Semiconductor Device Packaging
Method to improve near-field nonlinearity of a high-power diode laser array on a microchannel cooler
期刊论文
OPTICAL ENGINEERING, 2018, 卷号: 57, 期号: 3
作者:
Zhang, Hongyou
;
Jia, Yangtao
;
Cai, Wanshao
;
Tao, Chunhua
;
Zah, Chung-en
;
Liu, Xingsheng
;
Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(1473Kb)
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浏览/下载:315/2
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提交时间:2018/04/19
Thermal Stress
Diode Laser Arrays
Near-field Nonlinearity
Near-field Nonlinearity Along Laser Bar
Study on the near-field non-linearity (SMILE) of high power diode laser arrays
会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:
Zhang, Hongyou
;
Jia, Yangtao
;
Li, Changxuan
;
Zah, Chung-En
;
Liu, Xingsheng
;
Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(770Kb)
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浏览/下载:289/2
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提交时间:2018/04/25
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology
会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:
Yu, Dongshan
;
Liang, Xuejie
;
Wang, Jingwei
;
Li, Xiaoning
;
Nie, Zhiqiang
;
Liu, Xingsheng
Adobe PDF(667Kb)
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浏览/下载:398/2
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提交时间:2017/07/06
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:
Lu, Yao
;
Nie, Zhiqiang
;
Zhang, Pu
;
Wang, Zhenfu
;
Xiong, Lingling
;
Wang, Shuna
;
Wu, Dihai
;
Liu, Xingsheng
Adobe PDF(2218Kb)
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浏览/下载:278/1
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提交时间:2016/11/22
Computer Simulation
Electronics Packaging
High Power Lasers
Numerical Models
Occupational Risks
Optical Properties
Packaging
Power Semiconductor Diodes
Shear Stress
Thermal Stress
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode
会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:
Nie, Zhiqiang
;
Wu, Di
;
Lu, Yao
;
Wu, Dhai
;
Wang, Shuna
;
Zhang, Pu
;
Xiong, Lingling
;
Li, Xiaoning
;
Shen, Zenan
Adobe PDF(1806Kb)
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浏览/下载:248/1
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提交时间:2016/11/22
Chip Scale Packages
Defects
Degradation
Electronics Packaging
High Power Lasers
Laser Beam Welding
Power Semiconductor Diodes
Reliability
Reliability Analysis
Semiconductor Diodes
Thermal behavior of microchannel cooled high power diode laser arrays
会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
;
Zhu, Qiwen
;
Lu, Yao
;
Dang, Yifan
;
Liu, Xingsheng
Adobe PDF(2211Kb)
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浏览/下载:424/2
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提交时间:2016/11/22
Computational Fluid Dynamics
Copper
Crosstalk
Diodes
Electronics Packaging
Finite Element Method
Flow Of Water
Heat Resistance
Heat Sinks
Hydraulics
Laser Beam Welding
Microchannels
Numerical Methods
Optical Properties
Power Semiconductor Diodes
Reliability
Thermodynamic Properties
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum
会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:
Hou, Dong
;
Wang, Jingwei
;
Gao, Lijun
;
Liang, Xuejie
;
Li, Xiaoning
;
Liu, Xingsheng
;
Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)
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浏览/下载:241/1
  |  
提交时间:2016/10/18
Horizontal Array
Hard Solder
Spetrum Control
Packaging of Hard Solder 500W QCW Diode Laser Array
会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:
Li, Xiaoning
;
Wang, Jingwei
;
Hou, Dong
;
Nie, Zhiqiang
;
Liu, Xingsheng
;
Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)
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收藏
  |  
浏览/下载:198/1
  |  
提交时间:2016/10/18
Diode Laser
Mcc
Hard Solder
High Power