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Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：175/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Decoding algorithms and spatial resolution Monte Carlo simulation of cross strip anode for UV Astronomy 会议论文
INTERNATIONAL CONFERENCE ON PHOTONICS AND OPTICAL ENGINEERING (ICPOE 2014), Xian, PEOPLES R CHINA, 2014-10-13
作者:  Zhu Xiangping;  Deng Guobao
Adobe PDF(505Kb)  |  收藏  |  浏览/下载：156/0  |  提交时间：2015/12/04
Transmission loss in x-ray framing cameras 会议论文
INTERNATIONAL CONFERENCE ON PHOTONICS AND OPTICAL ENGINEERING (ICPOE 2014), Xian, PEOPLES R CHINA, 2014-10-13
作者:  Bai, Xiaohong;  Zhu, Bingli;  Bai, Yonglin;  Gou, Yongsheng;  Xu, Peng;  Jin, Jing;  Wang, Bo;  Liu, Baiyu;  Qin, Junjun
Adobe PDF(419Kb)  |  收藏  |  浏览/下载：245/6  |  提交时间：2015/12/04
An intelligent control system for X-ray framing camera 会议论文
2010 International Conference on Intelligent Computation Technology and Automation, ICICTA 2010, Changsha, China, 2010-05-11
作者:  Li Yan(李艳);  Bai Yonglin;  Wang Bo;  Liu Baiyu;  Xue Yingdong;  Bai Xiaohong;  Qin Junjun;  Zhao Wei(赵卫);  Gou Yongsheng;  Liu Xingsheng(刘兴胜)
Adobe PDF(386Kb)  |  收藏  |  浏览/下载：493/2  |  提交时间：2011/10/08
Packaging of high power semiconductor laser arrays using a novel macro-channel cooler 会议论文
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, 2010-08-16
作者:  Wang Jingwei;  Yuan Zhenbang;  Guo Lu;  Xiong Lingling;  Zhang Yanxin;  Peng Chenhui;  Li Xiaoning;  Liu Xingsheng(刘兴胜)
Adobe PDF(715Kb)  |  收藏  |  浏览/下载：424/0  |  提交时间：2011/10/08