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Effect of Sintering Conditions on Electrochemical Properties of LiNi0.8Co0.1Mn0.1O2 as Cathode Material 期刊论文
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2020, 卷号: 15, 期号: 3, 页码: 1881-1892
作者:  Li, Jing;  Zhang, Maolin;  Zhang, Dongyan;  Yan, Yangxi;  Li, Zhimin;  Nie, Zhiqiang
Adobe PDF(106Kb)  |  收藏  |  浏览/下载：187/0  |  提交时间：2020/04/13
Cathode materials  LiNi0.8Co0.1Mn0.1O2 (NCM811)  Electrochemical properties  Sol-gel method  
Preparation and properties of Co0.85Se/RGO composite counter electrodes for quantum-dot-sensitized solar cells 期刊论文
JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2020, 卷号: 22, 期号: 1-2, 页码: 23-28
作者:  Zhang, Maolin;  Li, Jing;  Nie, Zhiqiang;  Zhang, Dongyan;  Yan, Yangxi;  Li, Zhimin
Adobe PDF(911Kb)  |  收藏  |  浏览/下载：155/0  |  提交时间：2020/05/25
Quantum-dot-sensitized solar cells  Counter electrodes  Co0.85Se/RGO composite materials  Electrochemical performances  
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：131/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：243/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：341/2  |  提交时间：2017/07/06
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：249/2  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：219/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：366/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：279/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature