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Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：204/1  |  提交时间：2017/06/08
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：355/1  |  提交时间：2017/07/18
Characterization of Far Field of Diode Laser by Three Dimensional Measurement 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Liu, Hui;  Yuan, Zhiyuan;  Cui, Long;  Wu, Di;  Liu, Xingsheng
Adobe PDF(758Kb)  |  收藏  |  浏览/下载：194/1  |  提交时间：2015/12/04
Study of the key aspects in developing kW-level diode lasers for solid state laser pumping 会议论文
Proceedings - 2014 International Conference Laser Optics, LO 2014, St. Petersburg, Russia, 2014-06-30
作者:  Li, Xiaoning;  Wang, Jingwei;  Cai, Wanshao;  Hao, Bei;  Hou, Dong;  Liu, Hui;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(249Kb)  |  收藏  |  浏览/下载：251/2  |  提交时间：2015/03/31
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging