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Research of nested X-ray concentrator for future X-ray timing astronomy 会议论文
Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics, Osaka, Japan, 2016-09-06
作者:  Sheng, Lizhi;  Zhao, Baosheng;  Qiang, Pengfei;  Liu, Duo
Adobe PDF(437Kb)  |  收藏  |  浏览/下载：197/0  |  提交时间：2017/04/26
Rearranging the lenslet array of the compact passive interference imaging system with high resolution 会议论文
AOPC 2017: Space Optics and Earth Imaging and Space Navigation, Beijing, China, 2017-06-04
作者:  Liu, Gang;  Wen, Desheng;  Song, Zongxi
Adobe PDF(383Kb)  |  收藏  |  浏览/下载：197/2  |  提交时间：2018/02/11
Design of imaging circuitry of space CCD camera based on FPGA 会议论文
AOPC 2017: Optical Sensing and Imaging Technology and Applications, Beijing, China, 2017-06-04
作者:  Liu, Meiying;  Wen, Desheng;  Wang, Hu;  Liu, Yang;  Zhao, Hui;  Liu, Meiying (liumeiying@opt.ac.cn)
Adobe PDF(312Kb)  |  收藏  |  浏览/下载：200/2  |  提交时间：2018/03/07
A novel design of subminiature star sensor's imaging system based on TMS320DM3730 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Liu, Meiying;  Wang, Hu;  Wen, Desheng;  Yang, Shaodong;  Liu, Meiying (liumeiying@opt.ac.cn)
Adobe PDF(683Kb)  |  收藏  |  浏览/下载：161/1  |  提交时间：2017/05/15
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：247/2  |  提交时间：2017/06/08
Stand-off laser Raman spectroscopy and its advancement in explosives detection 会议论文
AOPC 2017: Optical Spectroscopy and Imaging, Beijing, China, 2017-06-04
作者:  Liu, Sheng-Run;  Xue, Bin;  Li, Yi-Zhe;  Wang, Hui
Adobe PDF(581Kb)  |  收藏  |  浏览/下载：211/1  |  提交时间：2018/03/07
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：359/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：278/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：213/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control