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A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：90/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：163/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：172/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：120/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：139/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：255/2  |  提交时间：2018/04/25
Study on the near-field non-linearity (SMILE) of high power diode laser arrays 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Zhang, Hongyou;  Jia, Yangtao;  Li, Changxuan;  Zah, Chung-En;  Liu, Xingsheng;  Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(770Kb)  |  收藏  |  浏览/下载：255/2  |  提交时间：2018/04/25
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：189/1  |  提交时间：2017/05/27
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：281/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature