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高功率半导体激光器互连界面可靠性研究 期刊论文
红外与激光工程, 2018, 卷号: 47, 期号: 11, 页码: 109-116
作者:  彭勃;  张普;  陈天奇;  赵崟岑;  吴的海;  刘晖
Adobe PDF(1756Kb)  |  收藏  |  浏览/下载：227/1  |  提交时间：2019/01/03
可靠性  高功率半导体激光器  互连界面  寿命  有限元  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：218/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：362/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
Double-cutting beam shaping technique for high-power diode laser area light source 期刊论文
OPTICAL ENGINEERING, 2013, 卷号: 52, 期号: 10
作者:  Huang, Zhihua;  Xiong, Lingling;  Liu, Hui;  Wang, Zhenfu;  Zhang, Pu;  Nie, Zhiqiang;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2938Kb)  |  收藏  |  浏览/下载：339/1  |  提交时间：2014/09/17
Beam Shaping  Beam Parameter Product  Laser Diode  Fiber Coupling  
3000W CW diode laser cladding system 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Lingling Xiong;  Min Wang;  Xiaobiao Wang;  Yanfang Zheng;  Di Wu;  Pu Zhang;  Xiaoning Li;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(7498Kb)  |  收藏  |  浏览/下载：564/1  |  提交时间：2013/01/16
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Zhiyong Zhang;  Pu Zhang;  Xiaoning Li;  Lingling Xiong;  Hui Liu;  Zhiqiang Nie;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(1758Kb)  |  收藏  |  浏览/下载：384/0  |  提交时间：2013/06/26