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Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Method to improve near-field nonlinearity of a high-power diode laser array on a microchannel cooler 期刊论文
OPTICAL ENGINEERING, 2018, 卷号: 57, 期号: 3
作者:  Zhang, Hongyou;  Jia, Yangtao;  Cai, Wanshao;  Tao, Chunhua;  Zah, Chung-en;  Liu, Xingsheng;  Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(1473Kb)  |  收藏  |  浏览/下载：281/2  |  提交时间：2018/04/19
Thermal Stress  Diode Laser Arrays  Near-field Nonlinearity  Near-field Nonlinearity Along Laser Bar  
Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Fan, Yingmin;  Wang, Jingwei;  Cai, Lei;  Mitra, Thomas;  Hauschild, Dirk;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(5638Kb)  |  收藏  |  浏览/下载：464/2  |  提交时间：2018/04/25
Study on the near-field non-linearity (SMILE) of high power diode laser arrays 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Zhang, Hongyou;  Jia, Yangtao;  Li, Changxuan;  Zah, Chung-En;  Liu, Xingsheng;  Zhang, Hongyou (zhanghy01@focuslight.com)
Adobe PDF(770Kb)  |  收藏  |  浏览/下载：252/2  |  提交时间：2018/04/25
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：184/1  |  提交时间：2017/05/27
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：204/1  |  提交时间：2017/06/08
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：215/0  |  提交时间：2015/12/04
Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Wang, Jingwei;  Li, Xiaoning;  Feng, Feifei;  Liu, Yalong;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(476Kb)  |  收藏  |  浏览/下载：176/0  |  提交时间：2015/12/04
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：355/1  |  提交时间：2017/07/18