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Thermally induced chirp studies on spectral broadening of semiconductor laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 20, 页码: 5599-5603
作者:  Zhang, Hongyou;  Jia, Yangtao;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1168Kb)  |  收藏  |  浏览/下载：209/2  |  提交时间：2018/09/12
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：359/1  |  提交时间：2017/07/18