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Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：205/2  |  提交时间：2017/06/08
Multiwavelength erbium-doped fiber laser based on an all-fiber polarization interference filter 会议论文
25th International Conference on Optical Fiber Sensors, Jeju, Korea, Republic of, 2017-04-24
作者:  Wang, Hushan;  Yan, Zhijun;  Zhou, Kaiming;  Song, Jiazheng;  Feng, Ye;  Wang, Yishan;  Yan, Zhijun (yanzhijun@gmail.com)
Adobe PDF(762Kb)  |  收藏  |  浏览/下载：250/2  |  提交时间：2017/05/27
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：250/2  |  提交时间：2017/06/08
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：207/1  |  提交时间：2017/06/08
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：372/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：280/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Microwave and RF Applications for Micro-resonator based Frequency Combs 会议论文
INTEGRATED OPTICS: DEVICES, MATERIALS, AND TECHNOLOGIES XX, San Francisco, CA, 2016-02-15
作者:  Nguyen, Thach G.;  Shoeiby, Mehrdad;  Ferrera, Marcello;  Pasquazi, Alessia;  Peccianti, Marco;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.;  Nguyen, TG (reprint author), RMIT Univ, Schoof Elect & Comp Engn, Melbourne, Vic 3001, Australia.
Adobe PDF(716Kb)  |  收藏  |  浏览/下载：169/0  |  提交时间：2016/10/18
Component  Cmos Silicon Photonics  Integrated Optics  Integrated Optics Nonlinear  Integrated Optics Materials  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：232/1  |  提交时间：2015/12/04
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Zhang, Pu;  Wang, Jingwei;  Xiong, Lingling;  Li, Xiaoning;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(624Kb)  |  收藏  |  浏览/下载：198/1  |  提交时间：2015/12/04