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Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：205/2  |  提交时间：2017/06/08
Design of high precision temperature control system for to packaged LD 会议论文
AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, Beijing, China, 2017-06-04
作者:  Liang, Enji;  Luo, Baoke;  Zhuang, Bin;  He, Zhengquan;  He, Zhengquan (lajihuya@163.com)
Adobe PDF(324Kb)  |  收藏  |  浏览/下载：220/2  |  提交时间：2018/02/11
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：344/2  |  提交时间：2017/07/06
Integrated Kerr comb-based reconfigurable transversal differentiator for microwave photonic signal processing（SPIE） 会议论文
NANOPHOTONICS AUSTRALASIA 2017, Melbourne, AUSTRALIA, 2017-12-10
作者:  Xu, Xingyuan;  Wu, Jiayang;  Shoeiby, Mehrdad;  Nguyen, Thach G.;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.;  Moss, DJ (reprint author), Swinburne Univ Technol, Ctr Microphoton, Hawthorn, Vic 3122, Australia.
Adobe PDF(900Kb)  |  收藏  |  浏览/下载：188/1  |  提交时间：2018/03/28
Optical Frequency Combs  Micro-ring Resonator  Optical Signal Processing  
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：251/2  |  提交时间：2017/06/08
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：208/1  |  提交时间：2017/06/08