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High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：213/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：215/0  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：208/0  |  提交时间：2015/12/04
A 3000W 808nm QCW G-Stack Semiconductor Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Zhang, Pu;  Wang, Jingwei;  Hou, Dong;  Wang, Zhenfu;  Xiong, Ling Ling;  Liu, Hui;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(355Kb)  |  收藏  |  浏览/下载：211/2  |  提交时间：2015/12/04