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中国科学院西安光学精密机械研究所机构知识库
Xi'an Institute of Optics and Precision Mechanics,CAS
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刘兴胜 [16]
王警卫 [9]
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语种:英语
文献类型:会议论文
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Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging
会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:
Han, Yang
;
Sun, Lichen
;
Fu, Tuanwei
;
Gao, Lijun
;
Zheng, Yanfang
;
Chen, Yunzhu
;
Zhang, Xiaojuan
;
Yan, Minna
;
Zhao, Sicheng
;
Yang, Kai
;
Gao, Lei
;
Zah, Chungen
;
Liu, Xingsheng
Adobe PDF(503Kb)
  |  
收藏
  |  
浏览/下载:168/1
  |  
提交时间:2021/06/28
G-Stack Diode Laser
Macro-Channel
High Thermal Conductivity Material
Continuous Wave Mode
Low Thermal Resistance
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser
会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:
Wu, Di-Hai
;
Zah, Chung-En
;
Liu, Xingsheng
Adobe PDF(1529Kb)
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收藏
  |  
浏览/下载:131/1
  |  
提交时间:2019/06/28
high power diode laser
thermal model
heat spreading
thermal resistance
finite element method (FEM)
High-power low-smile vertically-stacked laser diode based on microchannel cooling
会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:
Zhang, Hongyou
;
Cai, Lei
;
Zah, Chung-En
;
Liu, Xingsheng
Adobe PDF(835Kb)
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收藏
  |  
浏览/下载:123/0
  |  
提交时间:2020/03/04
Thermal stress
laser diode array
SMILE effect
spectrum
Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics
会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:
Fan, Yingmin
;
Wang, Jingwei
;
Cai, Lei
;
Mitra, Thomas
;
Hauschild, Dirk
;
Zah, Chung-En
;
Liu, Xingsheng
Adobe PDF(5638Kb)
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收藏
  |  
浏览/下载:495/2
  |  
提交时间:2018/04/25
High power multiple wavelength diode laser stack for DPSSL application without temperature control
会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:
Hou, Dong
;
Yin, Xia
;
Wang, Jingwei
;
Chen, Shi
;
Zhan, Yun
;
Li, Xiaoning
;
Fan, Yingmin
;
Liu, Xingsheng
Adobe PDF(1505Kb)
  |  
收藏
  |  
浏览/下载:244/1
  |  
提交时间:2018/04/25
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology
会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:
Wang, Boxue
;
Jia, Yangtao
;
Zhang, Haoyu
;
Jia, Shiyin
;
Liu, Jindou
;
Wang, Weifeng
;
Liu, Xingsheng
Adobe PDF(3178Kb)
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  |  
浏览/下载:257/2
  |  
提交时间:2018/04/25
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:
Lu, Yao
;
Nie, Zhiqiang
;
Zhang, Pu
;
Wang, Zhenfu
;
Xiong, Lingling
;
Wang, Shuna
;
Wu, Dihai
;
Liu, Xingsheng
Adobe PDF(2218Kb)
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收藏
  |  
浏览/下载:245/1
  |  
提交时间:2016/11/22
Computer Simulation
Electronics Packaging
High Power Lasers
Numerical Models
Occupational Risks
Optical Properties
Packaging
Power Semiconductor Diodes
Shear Stress
Thermal Stress
Thermal behavior of microchannel cooled high power diode laser arrays
会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
;
Zhu, Qiwen
;
Lu, Yao
;
Dang, Yifan
;
Liu, Xingsheng
Adobe PDF(2211Kb)
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收藏
  |  
浏览/下载:378/2
  |  
提交时间:2016/11/22
Computational Fluid Dynamics
Copper
Crosstalk
Diodes
Electronics Packaging
Finite Element Method
Flow Of Water
Heat Resistance
Heat Sinks
Hydraulics
Laser Beam Welding
Microchannels
Numerical Methods
Optical Properties
Power Semiconductor Diodes
Reliability
Thermodynamic Properties
A compact QCW conduction-cooled high power semiconductor laser array
会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:
Zhu, Qiwen
;
Zhang, Pu
;
Wang, Shuna
;
Wu, Dihai
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
;
Liu, Xingsheng
Adobe PDF(1179Kb)
  |  
收藏
  |  
浏览/下载:284/3
  |  
提交时间:2016/11/22
Chip Scale Packages
Electronics Packaging
Finite Element Method
High Power Lasers
High Temperature Applications
Temperature
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum
会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:
Hou, Dong
;
Wang, Jingwei
;
Gao, Lijun
;
Liang, Xuejie
;
Li, Xiaoning
;
Liu, Xingsheng
;
Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)
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  |  
浏览/下载:219/1
  |  
提交时间:2016/10/18
Horizontal Array
Hard Solder
Spetrum Control