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Infrared Imaging of Magnetic Octupole Domains in Non-collinear Antiferromagnets 预印本
2023
作者:  Wang, Peng;  Xia, Wei;  Shen, Jinhui;  Chen, Yulong;  Peng, Wenzhi;  Zhang, Jiachen;  Pan, Haolin;  Yu, Xuhao;  Liu, Zheng;  Gao, Yang;  Niu, Qian;  Xu, Zhian;  Yang, Hongtao;  Guo, Yanfeng;  Hou, Dazhi
Adobe PDF(18811Kb)  |  收藏  |  浏览/下载：46/0  |  提交时间：2023/12/28
Single underwater image restoration based on descattering and color correction 期刊论文
Optik, 2022, 卷号: 259
作者:  Ke, Ke;  Zhang, Chunmin;  Tang, Qian;  He, Yifan;  Yao, Baoli
Adobe PDF(15997Kb)  |  收藏  |  浏览/下载：127/1  |  提交时间：2022/04/25
Underwater imaging  Adaptive dark channel  Local water light  Color correction  
Use of electrochemistry in mini-/micro-LEDs and VCSELs 会议论文
Light-Emitting Devices, Materials, and Applications XXVI, Virtual, Online, 2022-02-20
作者:  Kang, Jin-Ho;  Elafandy, Rami;  Li, Bingjun;  Song, Jie;  Han, Jung
Adobe PDF(2660Kb)  |  收藏  |  浏览/下载：118/1  |  提交时间：2022/07/14
EC etching  nanoporous GaN  miniLED  microLED  RGB array  DBR  VCSEL  blue laser  
Sequential Evolution of Colored Copper Surface Irradiated by Defocused Femtosecond Laser 期刊论文
Advanced Engineering Materials, 2020
作者:  Ding, Kaiwen;  Li, Ming;  Wang, Cong;  Lin, Nai;  Wang, Haoran;  Luo, Zhi;  Duan, Ji'an
Adobe PDF(2309Kb)  |  收藏  |  浏览/下载：173/3  |  提交时间：2020/04/09
defocus dependent  femtosecond laser  hydrophobicity  sequential colors  
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：144/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
Target detection method for small defects in ink area of planar glass element 会议论文
AOPC 2019: AI in Optics and Photonics, Beijing, China, 2019-07-07
作者:  Qi, Wenbo;  Wang, Zhengzhou;  Wang, Li;  Tan, Meng;  Wei, Jitong
Adobe PDF(386Kb)  |  收藏  |  浏览/下载：143/1  |  提交时间：2020/02/28
Planar glass element  Ink area  small and weak defect target  target detection  self-correlation template matching  one-dimensional maximum entropy  
A fast method for searching the best matching point of the automatic reconstruction of focal spot measurement using the steepest descent method 会议论文
Optical Sensing and Imaging Technologies and Applications, Beijing, China, 2018-05-22
作者:  Wang, Zhengzhou;  Wang, Yanchao;  Li, Gang;  Tan, Meng;  Wang, Wei
Adobe PDF(681Kb)  |  收藏  |  浏览/下载：148/1  |  提交时间：2019/03/07
Simple and fast spectral domain algorithm for quantitative phase imaging of living cells with digital holographic microscopy 会议论文
THREE-DIMENSIONAL AND MULTIDIMENSIONAL MICROSCOPY: IMAGE ACQUISITION AND PROCESSING XXIV, San Francisco, CA, 2017-01-30
作者:  Min, Junwei;  Yao, Baoli;  Ketelhut, Steffi;  Kemper, Bjoern;  Kemper, B (reprint author), Univ Munster, Biomed Technol Ctr, Mendelstr 17, D-48149 Munster, Germany.
Adobe PDF(1076Kb)  |  收藏  |  浏览/下载：192/0  |  提交时间：2017/09/07
Digital Holographic Microscopy  Aberration Compensation  Frequency Spectrum Analysis  Quantitative Phase Imaging  Quantitative Live Cell Analysis  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：245/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：284/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature