中文版 | English

在结果中检索

OPT OpenIR

浏览/检索结果: 共29条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long;  Yang, Yingkun;  Mei, Yunhui (yunhui@tju.edu.cn)
Adobe PDF(1037Kb)  |  收藏  |  浏览/下载：230/1  |  提交时间：2017/07/18
Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：208/2  |  提交时间：2017/06/08
Design and analysis of micro stress flexible support structure of reflector in all-day star tracker 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Liu, Yang;  Chen, Su;  Wang, Lingguang;  Geng, Bo;  Wang, Hu;  Liu, Jie
Adobe PDF(547Kb)  |  收藏  |  浏览/下载：184/0  |  提交时间：2017/05/15
Modal analysis of collimation frame fabricated by titanium alloy 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Zhang, Yongqiang(张永强);  Liu, Zhaohui(刘朝晖);  Li, Zhiguo(李治国)
Adobe PDF(499Kb)  |  收藏  |  浏览/下载：208/1  |  提交时间：2017/05/15
Design of high precision temperature control system for to packaged LD 会议论文
AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, Beijing, China, 2017-06-04
作者:  Liang, Enji;  Luo, Baoke;  Zhuang, Bin;  He, Zhengquan;  He, Zhengquan (lajihuya@163.com)
Adobe PDF(324Kb)  |  收藏  |  浏览/下载：224/2  |  提交时间：2018/02/11
Numerical analysis of thermally tunable liquid-crystal-filled terahertz fiber 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Wang, Doudou;  Ma, Hongwei;  Wang, Lili;  Li, Baihong;  Yang, Jing
Adobe PDF(333Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2017/05/15
Laser spot center location algorithm based on sub-pixel interpolation 会议论文
AOPC 2017: Optical Sensing and Imaging Technology and Applications, Beijing, China, 2017-06-04
作者:  Liu, Tong;  Tian, Yan(田雁);  Wu, Jingyao;  Liu, Tong (liutong2015@opt.cn)
Adobe PDF(563Kb)  |  收藏  |  浏览/下载：245/2  |  提交时间：2018/03/07
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：352/2  |  提交时间：2017/07/06
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：252/2  |  提交时间：2017/06/08
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：210/1  |  提交时间：2017/06/08