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Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：207/2  |  提交时间：2017/06/08
Brownian dynamics of the optically trapped spinning microparticles in low pressures 会议论文
AOPC 2017: Optoelectronics and Micro/Nano-Optics, Beijing, China, 2017-06-04
作者:  Lang, Mengjiao;  Xiong, Wei;  Xiao, Guangzong;  Han, Xiang;  Tang, Jianxun;  Xiao, Guangzong (xiaoguangzong@nudt.edu.cn)
Adobe PDF(579Kb)  |  收藏  |  浏览/下载：378/0  |  提交时间：2018/02/11
The study of quantum spectral imaging 会议论文
QUANTUM SENSING AND NANO ELECTRONICS AND PHOTONICS XIV, San Francisco, CA, 2017-01-29
作者:  Bi, Siwen;  Wang, Guoguo;  Wang, Li;  Chen, Mingrui;  Dou, Xibo;  Liu, Wangyun;  Chen, Lu;  Lu, Baozhu;  Bi, SW
Adobe PDF(993Kb)  |  收藏  |  浏览/下载：152/1  |  提交时间：2017/09/12
Quantum Spectra  Quantum Light Field(Light Field Quantization)  Experiment  Technology  Quantum Spectral Imaging  
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：352/2  |  提交时间：2017/07/06
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：192/1  |  提交时间：2017/05/27
Status of the 20 inch MCP-PMT prototype development for JUNO experiment 会议论文
XXVII International Conference on Neutrino Physics and Astrophysics, Neutrino 2016, South Kensington, United kingdom, 2016-07-04
作者:  Gao, Feng;  Huang, Guorui;  Heng, Yuekun;  Li, Dong;  Liu, Hulin;  Liu, Shulin;  Li, Weihua;  Ning, Zhe;  Qi, Ming;  Qian, Sen;  Ren, Ling;  Sun, Jianning;  Si, Shuguang;  Tian, Jinshou;  Wang, Yifang;  Wei, Yonglin;  Xin, Liwei;  Zhao, Tianchi;  Qian, Sen (qians@ihep.ac.cn)
Adobe PDF(500Kb)  |  收藏  |  浏览/下载：250/2  |  提交时间：2017/12/28
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：252/2  |  提交时间：2017/06/08
Design of low noise imaging system 会议论文
AOPC 2017: Optical Storage and Display Technology, Beijing, China, 2017-06-04
作者:  Bo Hu;  Xiaolai Chen
Adobe PDF(843Kb)  |  收藏  |  浏览/下载：127/1  |  提交时间：2018/01/22
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：246/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：223/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes