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High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun;  Li, Xiaoning;  Fan, Yingmin;  Liu, Xingsheng
Adobe PDF(1505Kb)  |  收藏  |  浏览/下载：247/1  |  提交时间：2018/04/25
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：373/1  |  提交时间：2017/07/18
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：266/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging